SAWA CLEAN - Automatic Metal Stencil Cleaner


SC-MM3-E2
  • High pressure shower, Separation strength and Ultrasonic energy: Triple cleaning power can clean the bump stencil with 50 micrometer apertures.

  • Best for Ball-bump print in Flip-chip mounting.
  • Easy setting for a stencil size of 320mm‚~1000 x 740mm.
  • Just one pushbutton operation from cleaning to drying.
  • Perfect cleaning for lead-free solder paste.

CLEANING EFFECT
 
Before Clening
 
After Cleaning
Aperture Ø 0.1 mm WAFER BUMP STENCIL