Reflow Soldering System


TNR Series
  • High performance N2 reflow system for copying with lead-free.
  • Temperature difference between points of mounted boards is minimized by the adoption of speacial panel heaters arranged on top and bottom surface.
  • Free preparation of HAT profile with seven zone configuration (Trapezoidal profile).
  • Rapid quench profiles are made possible by the adoption of forced convection cooling mechanism built inside heat exchanger, 2 zones.
  • Easy operation by personal computer control.

TAR Series
  • High performance air reflow system for coping with lead-free.
  • Temperature difference between points of mounted boards is minimized by the adoption of special panel heaters arranged on top and bottom surface.
  • Free preparation of HAT profile (trapezoidal profile) with six zone configuration.
  • Easy operation by liquid crystal touch panel control.

TAS Series
  • Realizing high performances such as stabilized temperature characteriestics and free hand availability of profile, as a best selling series among Tamura's air reflow systems.
  • Despite one side lifting hood, maintenance from both sides is possible due to practical use of effective space.
  • Improvement of arrangement efficiency is expected through adoption of forced cooling mechanism.
  • Abundant options are available.